品牌:
Molex (莫仕)(50)
TE Connectivity (泰科)(6)
Mill-Max (仕元机械)(2)
Samtec (申泰电子)(5)
Sullins(1)
FCI Electronics (法马通)(1)
多选
包装:
Tube(65)
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Sullins
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn Hdr Fmal 29POS 1mm Gold t/h
    6259
    5-49
    19.5624
    50-199
    18.7264
    200-499
    18.2582
    500-999
    18.1412
    1000-2499
    18.0242
    2500-4999
    17.8904
    5000-7499
    17.8068
    ≥7500
    17.7232
  • 品牌: Samtec (申泰电子)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn Header 30POS Dual 2mm t/h
    7063
    1-9
    76.4520
    10-99
    73.1280
    100-249
    72.5297
    250-499
    72.0643
    500-999
    71.3330
    1000-2499
    71.0006
    2500-4999
    70.5353
    ≥5000
    70.1364
  • 品牌: Samtec (申泰电子)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Conn Unshrouded Header HDR 52POS 2mm Solder RA Thru-Hole Automotive Tube
    8936
    5-49
    20.6271
    50-199
    19.7456
    200-499
    19.2520
    500-999
    19.1286
    1000-2499
    19.0051
    2500-4999
    18.8641
    5000-7499
    18.7760
    ≥7500
    18.6878
  • 品牌: TE Connectivity (泰科)
    封装:
    Through Hole
    品类: 连接器
    描述:
    CONN RECPT 64POS T/H R/A TAB
    6171
    1-9
    81.8110
    10-99
    78.2540
    100-249
    77.6137
    250-499
    77.1158
    500-999
    76.3332
    1000-2499
    75.9775
    2500-4999
    75.4795
    ≥5000
    75.0527
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn Shrouded Header HDR 6POS 2.54mm Solder RA Thru-Hole Tube
    1240
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6排, PinEnd版本, 60电路,引脚长度4.25毫米( .167 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 60 Circuits, Pin Length 4.25mm (.167")
    1971
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 8排,导针信号模块,针端版本, 80电路,引脚长度6.25毫米( 0.246 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 80 Circuits, Pin Length 6.25mm (.246")
    7152
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6排, PinEnd版本, 150电路引脚长度4.75毫米( .187 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 150 Circuits, Pin Length 4.75mm (.187")
    5977
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®精简版板对板背板头,垂直, 8 RowOpen信号模块, 80回路,引脚长度6.25毫米( 0.246 ” ) 2.00mm (.079") Pitch VHDM® Lite Board-to-Board Backplane Header, Vertical, 8-RowOpen Signal Module, 80 circuits, Pin Length 6.25mm (.246")
    8957
    1-9
    72.6915
    10-99
    69.5310
    100-249
    68.9621
    250-499
    68.5196
    500-999
    67.8243
    1000-2499
    67.5083
    2500-4999
    67.0658
    ≥5000
    66.6866
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®精简版板对板背板头,垂直, 8 RowOpen信号模块, 200电路引脚长度5.15毫米( .203 ” ) 2.00mm (.079") Pitch VHDM® Lite Board-to-Board Backplane Header, Vertical, 8-RowOpen Signal Module, 200 circuits, Pin Length 5.15mm (.203")
    6427
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    1.85由1.85毫米( 0.073由0.073 “ )间距的GbX *背板连接器系统在2 , 3 , 4和5对列 1.85 by 1.85mm (.073 by .073”) Pitch GbX* Backplane Connector System in 2, 3, 4 and 5-Pair Columns
    6322
    1-9
    69.1840
    10-99
    66.1760
    100-249
    65.6346
    250-499
    65.2134
    500-999
    64.5517
    1000-2499
    64.2509
    2500-4999
    63.8298
    ≥5000
    63.4688
  • 品牌: TE Connectivity (泰科)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn Backplane M 100POS 1.27mm Solder ST Thru-Hole Tube
    3896
    1-9
    132.1005
    10-49
    128.6544
    50-99
    126.0124
    100-199
    125.0934
    200-499
    124.4042
    500-999
    123.4853
    1000-1999
    122.9109
    ≥2000
    122.3366
  • 品牌: TE Connectivity (泰科)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn Fine Pitch Connector PL 120POS 0.8mm Solder ST SMD Tube
    3882
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00 2.25毫米( .079由0.089 “ )间距5排, 6排和8排VHDM- HSD模块到背板连接器系统 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System
    5742
    1-9
    377.1655
    10-49
    367.3264
    50-99
    359.7831
    100-199
    357.1593
    200-499
    355.1915
    500-999
    352.5678
    1000-1999
    350.9279
    ≥2000
    349.2881
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC , SolderTail ,导针选项, 72电路 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
    6732
    1-9
    180.5385
    10-49
    175.8288
    50-99
    172.2180
    100-199
    170.9621
    200-499
    170.0202
    500-999
    168.7643
    1000-1999
    167.9793
    ≥2000
    167.1944
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    顶盖组件 HEADER ASSEMBLY
    7888
    5-24
    5.4540
    25-49
    5.0500
    50-99
    4.7672
    100-499
    4.6460
    500-2499
    4.5652
    2500-4999
    4.4642
    5000-9999
    4.4238
    ≥10000
    4.3632
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM板对板堆垛头,高层垂直, SMC 2.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC
    6500
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™接头,垂直,通孔,罩,无铅, 8电路, 0.76μm ( 30μ ),金(Au )电镀,中心极化槽 2.00mm (.079) Pitch Milli-Grid™ Header, Vertical, Through Hole, Shrouded, Lead-free, 8 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
    5365
    5-49
    12.0159
    50-199
    11.5024
    200-499
    11.2148
    500-999
    11.1430
    1000-2499
    11.0711
    2500-4999
    10.9889
    5000-7499
    10.9376
    ≥7500
    10.8862
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC ,压接,导柱位置A,偏光关键位置d , 72电路 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 72 Circuits
    7565
    1-9
    344.9195
    10-49
    335.9216
    50-99
    329.0232
    100-199
    326.6238
    200-499
    324.8242
    500-999
    322.4248
    1000-1999
    320.9251
    ≥2000
    319.4255
  • 品牌: Samtec (申泰电子)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Conn Unshrouded Header HDR 86POS 2mm Solder ST Thru-Hole
    6005
    1-9
    113.7695
    10-99
    108.8230
    100-249
    107.9326
    250-499
    107.2401
    500-999
    106.1519
    1000-2499
    105.6572
    2500-4999
    104.9647
    ≥5000
    104.3712
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    Header Connector, PCB Mount, RECEPT, 20Contacts, PIN, 0.1 Pitch, PC TAIL Terminal, LOCKING MECH
    9226
    1-9
    52.3868
    10-99
    49.3810
    100-249
    47.1481
    250-499
    46.8046
    500-999
    46.4611
    1000-2499
    46.0746
    2500-4999
    45.7311
    ≥5000
    45.5164
  • 品牌: Samtec (申泰电子)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn DIP Socket SKT 40POS 2.54mm Solder ST Thru-Hole Tube
    6196
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Samtec (申泰电子)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn DIP Socket SKT 28POS 2.54mm Solder ST Thru-Hole Tube
    7343
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM板对板背板头,垂直, 6排,针端版本, 150 2.00mm (.079") Pitch VHDM Board-to-Board Backplane Header, Vertical, 6-Row, Pin End Version, 150
    2136
    1-9
    532.3465
    10-49
    518.4592
    50-99
    507.8123
    100-199
    504.1090
    200-499
    501.3315
    500-999
    497.6283
    1000-1999
    495.3137
    ≥2000
    492.9992
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6排, PinEnd版本, 60电路,引脚长度4.75毫米( .187 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 60 Circuits, Pin Length 4.75mm (.187")
    5292
    1-9
    115.8855
    10-49
    112.8624
    50-99
    110.5447
    100-199
    109.7385
    200-499
    109.1339
    500-999
    108.3278
    1000-1999
    107.8239
    ≥2000
    107.3201
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6排,针端版本, 150电路引脚长度4.75毫米( .187 ” ) 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-Row, Pin End Version, 150 Circuits, Pin Length 4.75mm (.187")
    6960
    1-9
    538.1540
    10-49
    524.1152
    50-99
    513.3521
    100-199
    509.6084
    200-499
    506.8007
    500-999
    503.0570
    1000-1999
    500.7172
    ≥2000
    498.3774
  • 品牌: TE Connectivity (泰科)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    Conn HDI RCP 20POS 2.54mm Solder ST Thru-Hole Tube
    4490
    20-49
    0.0000
    50-99
    0.0000
    100-299
    0.0000
    300-499
    0.0000
    500-999
    0.0000
    1000-4999
    0.0000
    5000-9999
    0.0000
    ≥10000
    0.0000
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC , SolderTail ,导针选项, 72电路 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits
    1913
    1-9
    145.2105
    10-49
    141.4224
    50-99
    138.5182
    100-199
    137.5080
    200-499
    136.7504
    500-999
    135.7403
    1000-1999
    135.1089
    ≥2000
    134.4776
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器与适配器
    描述:
    2.00毫米( .079 “ )间距VHDM®板对板背板头,垂直, 6 RowOpen信号模块, 60线路, 10列,引脚长度5.15毫米( .203 ” ) , 0.76μm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 6-RowOpen Signal Module, 60 Circuits, 10 Columns, Pin Length 5.15mm (.203"), 0.76μm
    6648
    1-9
    90.3785
    10-99
    86.4490
    100-249
    85.7417
    250-499
    85.1916
    500-999
    84.3271
    1000-2499
    83.9341
    2500-4999
    83.3840
    ≥5000
    82.9125
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    品类: 连接器
    描述:
    2.00毫米( 0.079 )间距的Milli-电网™接头,直角,带罩,无铅, 30电路, 0.76μm ( 30μ ),金(Au ),电镀,无PCB定位器,带锁定的Windows 2.00mm (.079) Pitch Milli-Grid™ Header, Right Angle, Shrouded, Lead-free, 30 Circuits, 0.76μm (30μ) Gold (Au) Plating, without PCB Locator, with Locking Windows
    5492
    5-49
    18.7434
    50-199
    17.9424
    200-499
    17.4938
    500-999
    17.3817
    1000-2499
    17.2696
    2500-4999
    17.1414
    5000-7499
    17.0613
    ≥7500
    16.9812

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空